UiTM & TP-Link Sign 3-Year MoU To Enhance Student Enterprise Networking Skills

The partnership will provide students with hands-on enterprise networking experiences and OCNA certifications.

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TP-Link Distribution Malaysia Sdn Bhd and Universiti Teknologi MARA (UiTM) have entered into a strategic partnership aimed at equipping students with industry-ready enterprise networking skills

The two organisations signed a Memorandum of Understanding (MoU) on Friday, 10 April in Shah Alam, establishing a three-year collaboration to bridge the gap between academic theory and real-world industrial requirements.

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Image via TP-Link (Provided to SAYS)

Through this initiative, UiTM students will gain access to hands-on experience with enterprise-grade infrastructure and globally recognised certifications

Central to the agreement is the deployment of Omada by TP-Link enterprise networking solutions within UiTM laboratories.

This allows students to train on the same hardware and software used in professional business environments, complemented by technical workshops and a structured pathway towards the Omada Certified Network Administrator (OCNA) certification.

Image via TP-Link (Provided to SAYS)

The partnership also creates clear career pathways through internship and industrial training opportunities directly with TP-Link

This builds upon TP-Link's previous success with Universiti Malaya, where over 500 students engaged in similar certification programmes in 2025.

Image via TP-Link (Provided to SAYS)

UiTM Vice-Chancellor Prof Datuk Dr Shahrin Sahib @ Sahibuddin said ensuring graduates possess both academic knowledge and practical skills is critical in a rapidly evolving digital landscape

He added that such partnerships allow the university to align its academic programmes more closely with modern technological advancements and industry expectations.

Beyond student development, the MoU outlines plans for joint research initiatives, consultations, and knowledge exchange between TP-Link engineers and UiTM faculty members.

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